Introducing new foundation models, a robot learning framework, AI workflow orchestration and robot perception tools.
AI is transforming industries and tackling global challenges. The NVIDIA Jetson™ platform drives this revolution by providing tools to develop and deploy AI-powered robots, drones, IVA applications, and autonomous machines. Powered by generative AI at the edge, as well as NVIDIA Metropolis and Isaac™ platforms, Jetson offers scalable software, modern AI stack, flexible microservices and APIs, production-ready ROS packages, and application-specific AI workflows.
The new Jetson Orin™ platform also gives you up to 275 trillion operations per second and 8X the performance of the last generation. Seven different modules based on the same architecture—from the entry-level Jetson Orin Nano™ to the highest performance Jetson AGX Orin—make this the ideal platform for the new age of robotics.
See how companies across industries are transforming
their business with Jetson embedded systems.
NVIDIA Jetson modules deliver accelerated computing capabilities at different performance levels and prices to suit a variety of autonomous applications. From manufacturing to construction, healthcare to delivery, the Jetson platform delivers unequaled performance, power efficiency, and ease of development.
Two Jetson Orin developer kits are available to get started developing and prototyping your next product. The compact Jetson AGX Orin Developer Kit offers maximum Jetson Orin performance, but can also emulate any of the Jetson Orin modules. The Jetson Orin Nano Developer Kit is even smaller, and includes a reference carrier board compatible with all Orin NX and Orin Nano modules.
The Jetson Generative AI Lab is your gateway to bringing this amazing technology to the world. Explore tutorials on text generation, text + vision models, image generation, distillation techniques, and access resources to run these models on the NVIDIA Jetson Orin™. Experience real-time performance with vision LLMs and the latest one-shot Vision Transformers (ViTs). And deploy game-changing capabilities locally. Join the generative AI revolution and start today.
NVIDIA Jetson Orin and Jetson Xavier™ modules feature Deep Learning Accelerators (DLA)–fixed-function accelerator engines for hardware acceleration of deep learning operations. It’s capable of efficiently executing and pooling layers that are common in modern neural network architectures.
Robotics and automation are increasingly being used in manufacturing, agriculture, construction, energy, government, and other industries. These applications often require extended temperature, shock, and vibration specifications to operate in harsh environments. The NVIDIA Jetson platform offers multiple options for rugged applications.
Contact us to learn more about NVIDIA Jetson.
Jetson AGX Orin series | Jetson Orin NX series | Jetson Orin Nano series | Jetson AGX Xavier series | Jetson Xavier NX series | Jetson TX2 series | Jetson Nano | ||||||||||||||
Jetson AGX Orin Developer Kit | Jetson AGX Orin 64GB | Jetson AGX Orin Industrial | Jetson AGX Orin 32GB | Jetson Orin NX 16GB | Jetson Orin NX 8GB | Jetson Orin Nano Developer Kit | Jetson Orin Nano 8GB | Jetson Orin Nano 4GB | Jetson AGX Xavier Industrial | Jetson AGX Xavier 64GB | Jetson AGX Xavier 32GB | Jetson Xavier NX 16GB | Jetson Xavier NX 8GB | Jetson TX2i | Jetson TX2 | Jetson TX2 4GB | Jetson TX2 NX | Jetson Nano | Jetson Nano Developer Kit | |
AI Performance | 275 TOPS | 248 TOPs | 200 TOPS | 100 TOPS | 70 TOPS | 40 TOPS | 20 TOPS | 30 TOPS | 32 TOPS | 21 TOPS | 1.26 TFLOPS | 1.33 TFLOPS | 472 GFLOPS | |||||||
GPU | 2048-core NVIDIA Ampere architecture GPU with 64 Tensor Cores | 1792-core NVIDIA Ampere c GPU with 56 Tensor Cores | 1024-core NVIDIA Ampere architecture GPU with 32 Tensor Cores | 1024-core NVIDIA Ampere architecture GPU with 32 Tensor Cores | 512-core NVIDIA Ampere architecture GPU with 16 Tensor Cores | 512-core NVIDIA Volta architecture GPU with 64 Tensor Cores | 384-core NVIDIA Volta™ architecture GPU with 48 Tensor Cores | 256-core NVIDIA Pascal™ architecture GPU | 128-core NVIDIA Maxwell™ architecture GPU | |||||||||||
GPU Max Frequency | 1.3 GHz | 1.2 GHz | 930 MHz | 918 MHz | 765 MHz | 625 MHz | 1211 MHz | 1377 MHz | 1100 MHz | 1.12GHz | 1.3 GHz | 921MHz | ||||||||
CPU | 12-core Arm® Cortex®-A78AE v8.2 64-bit CPU 3MB L2 + 6MB L3 |
8-core Arm® Cortex®-A78AE v8.2 64-bit CPU 2MB L2 + 4MB L3 |
8-core Arm® Cortex®-A78AE v8.2 64-bit CPU 2MB L2 + 4MB L3 |
6-core Arm® Cortex®-A78AE v8.2 64-bit CPU 1.5MB L2 + 4MB L3 |
6-core Arm® Cortex®-A78AE v8.2 64-bit CPU 1.5MB L2 + 4MB L3 |
8-core NVIDIA Carmel Arm®v8.2 64-bit CPU 8MB L2 + 4MB L3 |
6-core NVIDIA Carmel Arm®v8.2 64-bit CPU 6MB L2 + 4MB L3 |
Dual-core NVIDIA Denver™ 2 64-bit CPU and quad-core Arm® Cortex®-A57 MPCore processor | Quad-core ARM® Cortex®-A57 MPCore processor | |||||||||||
CPU Max Frequency | 2.2 GHz | 2.0 GHz | 2.2 GHz | 2 GHz | 1.5 GHz | 2.0 GHz | 2.2 GHz | 1.9 GHz | Denver2: 1.95 GHz Cortex-A57: 1.92 GHz |
Denver 2: 2 GHz Cortex-A57: 2 GHz |
1.43GHz | |||||||||
DL Accelerator | 2x NVDLA v2 | 1x NVDLA v2 | - | 2x NVDLA | 2x NVDLA | - | - | |||||||||||||
DLA Max Frequency | 1.6 GHz | 1.4 GHz | 614 MHz | - | 1.2 GHz | 1.4 GHz | 1.1 GHz | - | - | |||||||||||
Vision Accelerator | 1x PVA v2 | - | 2x PVA | 2x PVA | - | - | ||||||||||||||
Safety Cluster Engine | - | - | - | 2x Arm® Cortex®-R5 in lockstep | - | - | - | - | ||||||||||||
Memory | 64GB 256-bit LPDDR5 204.8GB/s |
64GB 256-bit LPDDR5 (+ ECC) 204.8GB/s |
32GB 256-bit LPDDR5 204.8GB/s |
16GB 128-bit LPDDR5 102.4GB/s |
8GB 128-bit LPDDR5 102.4GB/s |
8GB 128-bit LPDDR5 68 GB/s |
4GB 64-bit LPDDR5 34 GB/s |
32GB 256-bit LPDDR4x (ECC support) 136.5GB/s |
64GB 256-bit LPDDR4x 136.5GB/s |
32GB 256-bit LPDDR4x 136.5GB/s |
16GB 128-bit LPDDR4x 59.7GB/s |
8GB 128-bit LPDDR4x 59.7GB/s |
8GB 128-bit LPDDR4 (ECC Support) 51.2GB/s |
8GB 128-bit LPDDR4 59.7GB/s |
4GB 128-bit LPDDR4 51.2GB/s |
4GB 64-bit LPDDR4 25.6GB/s |
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Storage | 64GB eMMC 5.1 | - (Supports external NVMe) |
- (SD Card Slot & external NVMe via M.2 Key M) |
- (Supports external NVMe) |
64GB eMMC 5.1 | 32GB eMMC 5.1 | 16GB eMMC 5.1 | 32GB eMMC 5.1 | 16GB eMMC 5.1 | 16GB eMMC 5.1 | ||||||||||
Video Encode | 2x 4K60 (H.265) 4x 4K30 (H.265) 8x 1080p60 (H.265) 16x 1080p30 (H.265) |
1x 4K60 (H.265) 3x 4K30 (H.265) 7x 1080p60 (H.265) 15x 1080p30 (H.265) |
1x 4K60 (H.265) 3x 4K30 (H.265) 6x 1080p60 (H.265) 12x 1080p30 (H.265) |
1080p30 supported by 1-2 CPU cores |
2x 4K60 (H.265) 6x 4K30 (H.265) 12x 1080p60 (H.265) 24x 1080p30 (H.265) |
4x 4K60 (H.265) 8x 4K30 (H.265) 16x 1080p60 (H.265) 32x 1080p30 (H.265) |
2x 4K60 (H.265) 4x 4K30 (H.265) 10x 1080p60 (H.265) 22x 1080p30 (H.265) |
1x 4K60 (H.265) 3x 4K30 (H.265) 4x 1080p60 (H.265) |
1x 4K30 (H.265) 2x 1080p60 (H.265) |
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Video Decode | 1x 8K30 (H.265) 3x 4K60 (H.265) 7x 4K30 (H.265) 11x 1080p60 (H.265) 22x 1080p30 (H.265) |
1x 8K30 (H.265) 3x 4K60 (H.265) 7x 4K30 (H.265) 11x 1080p60 (H.265) 23x 1080p30 (H.265) |
1x 8K30 (H.265) 2x 4K60 (H.265) 4x 4K30 (H.265) 9x 1080p60 (H.265) 18x 1080p30 (H.265) |
1x 4K60 (H.265) 2x 4K30 (H.265) 5x 1080p60 (H.265) 11x 1080p30 (H.265) |
2x 8K30 (H.265) 4x 4K60 (H.265) 8x 4K30 (H.265) 18x 1080p60 (H.265) 36x 1080p30 (H.265) |
2x 8K30 (H.265) 6x 4K60 (H.265) 12x 4K30 (H.265) 26x 1080p60 (H.265) 52x 1080p30 (H.265) |
2x 8K30 (H.265) 6x 4K60 (H.265) 12x 4K30 (H.265) 22x 1080p60 (H.265) 44x 1080p30 (H.265) |
2x 4K60 (H.265) 7x 1080p60 (H.265) 14x 1080p30 (H.265) |
1x 4K60 (H.265) 4x 1080p60 (H.265) |
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CSI Camera | 16-lane MIPI CSI-2 connector |
Up to 6 cameras (16 via virtual channels) 16 lanes MIPI CSI-2 D-PHY 2.1 (up to 40Gbps) | C-PHY 2.0 (up to 164Gbps) |
Up to 4 cameras (8 via virtual channels***) 8 lanes MIPI CSI-2 D-PHY 2.1 (up to 20Gbps) |
2x MIPI CSI-2 22-pin Camera Connectors |
Up to 4 cameras (8 via virtual channels***) 8 lanes MIPI CSI-2 D-PHY 2.1 (up to 20Gbps) |
Up to 6 cameras (36 via virtual channels) 16 lanes MIPI CSI-2 D-PHY 1.2 (up to 40 Gbps) C-PHY 1.1 (up to 62 Gbps) |
Up to 6 cameras (36 via virtual channels) 16 lanes MIPI CSI-2 | 8 lanes SLVS-EC D-PHY 1.2 (up to 40 Gbps) C-PHY 1.1 (up to 62 Gbps) |
Up to 6 cameras (24 via virtual channels) 14 lanes MIPI CSI-2 D-PHY 1.2 (up to 30 Gbps) |
Up to 6 cameras (12 via virtual channels) 12 lanes MIPI CSI-2 D-PHY 1.2 (up to 30 Gbps) |
Up to 5 cameras (12 via virtual channels) 12 lanes MIPI CSI-2 D-PHY 1.1 (up to 30 Gbps) |
Up to 4 cameras 12 lanes MIPI CSI-2 D-PHY 1.1 (up to 18 Gbps) |
2x 15-pin 2-lane MIPI CSI-2 camera connectors | ||||||||
PCIe* | x16 PCIe slot supporting x8 PCIe Gen4 M.2 Key M slot with x4 PCIe Gen4 M.2 Key E slot with x1 PCIe Gen4 |
Up to 2 x8 + 1 x4 + 2 x1 (PCIe Gen4, Root Port, & Endpoint) |
1 x4 + 3 x1 (PCIe Gen4, Root Port, & Endpoint) |
M.2 Key M slot with x4 PCIe Gen3 M.2 Key M slot with x2 PCIe Gen3 M.2 Key E slot |
1 x4 + 3 x1 (PCIe Gen3, Root Port, & Endpoint) |
1 x8 + 1 x4 + 1 x2 + 2 x1 (PCIe Gen4, Root Port & Endpoint) |
1 x4 (PCIe Gen4) + 1 x1 (PCIe Gen3) | up to 1 x1 + 1 x4 OR 1 x1 + 1 x1 + 1 x2 (PCIe Gen2) |
1 x1 + 1 x2 (PCIe Gen2) |
1 x4 (PCIe Gen2) |
x1 on the M.2 Key E | |||||||||
USB* | USB Type-C connector: 2x USB 3.2 Gen2 USB Type-A connector: 2x USB 3.2 Gen2, 2x USB 3.2 Gen1 USB Micro-B connector: USB 2.0 |
3x USB 3.2 Gen2 (10 Gbps) 4x USB 2.0 |
3x USB 3.2 Gen2 (10 Gbps) 3x USB 2.0 |
USB Type-A Connector: 4x USB 3.2 Gen2 USB Type-C Connector for UFP |
3x USB 3.2 Gen2 (10 Gbps) 3x USB 2.0 |
3x USB 3.2 Gen2 (10 Gbps) 4x USB 2.0 |
1x USB 3.2 Gen2 (10 Gbps) 3x USB 2.0 |
up to 3x USB 3.0 (5 Gbps) 3x USB 2.0 |
1x USB 3.0 (5 Gbps) 3x USB 2.0 |
1x USB 3.0 (5 Gbps) 3x USB 2.0 |
4x USB 3.0 Type-A connectors 1x USB 2.0 Micro-B connector |
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Networking* | RJ45 connector with up to 10 GbE | 1x GbE 1x 10GbE |
1x GbE | 1xGbE Connector | 1x GbE | 1x GbE | 1x GbE | 1x GbE | 1x GbE, WLAN | 1x GbE | 1x GbE | Gigabit Ethernet, M.2 Key E | ||||||||
Display | 1x DisplayPort 1.4a (+MST) connector | 1x 8K60 multi-mode DP 1.4a (+MST)/eDP 1.4a/HDMI 2.1 | 1x 8K30 multi-mode DP 1.4a (+MST)/eDP 1.4a/HDMI 2.1 | 1x DisplayPort 1.2 (+MST) connector | 1x 4K30 multi-mode DP 1.2 (+MST)/eDP 1.4/HDMI 1.4** | 3 multi-mode DP 1.4/eDP 1.4/HDMI 2.0 | 2 multi-mode DP 1.4/eDP 1.4/HDMI 2.0 | 2 multi-mode DP 1.2/eDP 1.4/HDMI 2.0 2 x4 DSI (1.5Gbps/lane) |
2 multi-mode DP 1.2/eDP 1.4/HDMI 2.0 1x 2 DSI (1.5Gbps/lane) |
2 multi-mode DP 1.2/eDP 1.4/HDMI 2.0 1 x2 DSI (1.5Gbps/lane) |
1x HDMI 2.0 Connector 1x DP 1.2 Connector |
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Other I/O | 40-pin header (UART, SPI, I2S, I2C, CAN, PWM, DMIC, GPIO) 12-pin automation header 10-pin audio panel header 10-pin JTAG header 4-pin fan header 2-pin RTC batter backup connector microSD slot DC power jack Power, Force Recovery, and Reset buttons |
4x UART, 3x SPI, 4x I2S, 8x I2C, 2x CAN, PWM, DMIC & DSPK, GPIOs | 3x UART, 2x SPI, 2x I2S, 4x I2C, 1x CAN, DMIC & DSPK, PWM, GPIOs | 40-Pin Expansion Header(UART, SPI, I2S, I2C, GPIO) 12-pin button header 4-pin fan header microSD Slot DC power jack |
3x UART, 2x SPI, 2x I2S, 4x I2C, 1x CAN, DMIC & DSPK, PWM, GPIOs | 5x UART, 3x SPI, 4x I2S, 8x I2C, 2x CAN, PWM, DMIC, GPIOs | 3x UART, 2x SPI, 2x I2S, 4x I2C, 1x CAN, PWM, DMIC & DSPK, GPIOs | 5x UART, 3x SPI, 4x I2S, 8x I2C, 2x CAN, GPIOs | 3x UART, 2x SPI, 4x I2S, 4x I2C, 1x CAN, GPIOs | 3x UART, 2x SPI, 2x I2S, 4x I2C, GPIOs | 40-pin header (UART, SPI, I2S, I2C, PWM, GPIO) 12-pin automation header 4-pin fan header 4-pin POE header DC power jack Power, Force Recovery, and Reset buttons |
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Power | 15W - 60W | 15W-75W | 15W - 40W | 10W - 25W | 10W - 20W | 7W - 15W | 7W - 10W | 20W - 40W | 10W - 30W | 10W - 20W | 10W - 20W | 7.5W - 15W | 5W - 10W | |||||||
Mechanical | 110mm x 110mm x 71.65mm (Height includes feet, carrier board, module, and thermal solution) |
100mm x 87mm 699-pin Molex Mirror Mezz Connector Integrated Thermal Transfer Plate |
69.6mm x 45mm 260-pin SO-DIMM connector |
100 mm x 79 mmx 21 mm (Height includes feet, carrier board, module, and thermal solution) |
69.6mm x 45mm 260-pin SO-DIMM connector |
100mm x 87mm 699-pin connector Integrated Thermal Transfer Plate |
69.6mm x 45mm 260-pin SO-DIMM connector |
87mm x 50mm 400-pin connector Integrated Thermal Transfer Plate |
69.6mm x 45mm 260-pin SO-DIMM connector |
69.6mm x 45mm 260-pin SO-DIMM connector |
100mm x 79mm x 30.21mm (Height includes carrier board, module, and thermal solution) |
† The Jetson Nano and Jetson Xavier NX modules included as part of the Jetson Nano developer kit and the Jetson Xavier NX developer kit have slots for using microSD cards instead of eMMC as system storage devices.
*USB 3.2, MGBE, and PCIe share UPHY Lanes. See the Product Design Guide for supported UPHY configurations.
**See the Jetson Orin Nano Series Data Sheet for more details on additional compatibility to DP 1.4a and HDMI 2.1
***Virtual Channels for Jetson Orin NX and Jetson Orin Nano are subject to change
Refer to the Software Features section of the latest NVIDIA Jetson Linux Developer Guide for a list of supported features.
Jetson AGX Orin Commercial | Jetson AGX Orin Industrial | |
Mechanical Shock | Non-Operational: 140G, 2 ms | Non-Operational: 140G, 2 ms Operational 50G, 11 ms |
Vibration | Non-Operational: 3G | Non-Operational: 3G Operational 5G |
Temperature | -25°C - 80°C at TTP Surface | -40°C - 85°C at TTP Surface |
Humidity | 85°C, 85% RH, 168 hours | 85°C / 85% RH, 1000 hours, Power ON |
Temperature Endurance | -20°C, 24 hours 45°C, 168 hours (operational) |
-40°C, 72 hours 85°C, 1000 hours (operational) |
ECC | N/A | Inline DRAM ECC Supported |
Underfill | N/A | SoC Corner Bonding & Component Underfill |
Operating Lifetime | 5 Years | 10 Years |