Bring your next-gen products to life with the world’s most powerful embedded AI computers for generative AI, computer vision, and advanced robotics. The NVIDIA Jetson Orin™ family includes seven modules with identical architecture, offering up to 275 trillion operations per second (TOPS) and 8X the performance of the last generation for multimodal AI inference, plus high-speed interface support. The powerful software stack features pre-trained AI models, reference AI workflows and vertical application framework, accelerating end-to-end development for generative AI, as well as any edge AI and robotics application.
NVIDIA Jetson Orin developer kits let you develop full-featured AI applications for products based on Jetson Orin modules.
The NVIDIA Jetson Orin™ Nano Super Developer Kit is a compact, powerful computer that redefines generative AI for small edge devices. Priced at $249, it provides an affordable and accessible platform for developers, students, and makers, backed by NVIDIA AI software and a broad AI ecosystem. Purchase it from our partners, or upgrade your existing Jetson Orin Nano™ Developer Kit with the latest software.
The NVIDIA Jetson AGX Orin Developer Kit and all Jetson Orin modules share one System-on-Chip (SoC) architecture. This lets it emulate any of the modules and makes it easy for you to start developing your next AI-powered product. It is a powerful supercomputer for generative AI, robotics and computer vision applications.
NVIDIA Jetson Orin modules deliver accelerated computing capabilities at different performance levels and prices to suit a variety of autonomous applications.
Jetson AGX Orin series | Jetson Orin NX series | Jetson Orin Nano series | |||||||
Jetson AGX Orin Developer Kit | Jetson AGX Orin 64GB | Jetson AGX Orin Industrial | Jetson AGX Orin 32GB | Jetson Orin NX 16GB | Jetson Orin NX 8GB | Jetson Orin Nano Super Developer Kit | Jetson Orin Nano 8GB | Jetson Orin Nano 4GB | |
AI Performance | 275 TOPS | 248 TOPs | 200 TOPS | 157 TOPS | 117 TOPS | 67 TOPS | 67 TOPS | 34 TOPS | |
GPU | 2048-core NVIDIA Ampere architecture GPU with 64 Tensor Cores | 1792-core NVIDIA Ampere c GPU with 56 Tensor Cores | 1024-core NVIDIA Ampere architecture GPU with 32 Tensor Cores | 1024-core NVIDIA Ampere architecture GPU with 32 Tensor Cores | 512-core NVIDIA Ampere architecture GPU with 16 Tensor Cores | ||||
GPU Max Frequency | 1.3 GHz | 1.2 GHz | 930 MHz | 1173MHz | 1173MHz | 1020MHz | 1020MHz | 1020MHz | |
CPU | 12-core Arm® Cortex®-A78AE v8.2 64-bit CPU 3MB L2 + 6MB L3 |
8-core Arm® Cortex®-A78AE v8.2 64-bit CPU 2MB L2 + 4MB L3 |
8-core Arm® Cortex®-A78AE v8.2 64-bit CPU 2MB L2 + 4MB L3 |
6-core Arm® Cortex®-A78AE v8.2 64-bit CPU 1.5MB L2 + 4MB L3 |
6-core Arm® Cortex®-A78AE v8.2 64-bit CPU 1.5MB L2 + 4MB L3 |
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CPU Max Frequency | 2.2 GHz | 2.0 GHz | 2.2 GHz | 2 GHz | 1.7 GHz | 1.7 GHz | 1.7 GHz | ||
DL Accelerator | 2x NVDLA v2 | 1x NVDLA v2 | - | ||||||
DLA Max Frequency | 1.6 GHz | 1.4 GHz | 1.23 GHz | - | |||||
Vision Accelerator | 1x PVA v2 | - | |||||||
Safety Cluster Engine | - | - | - | ||||||
Memory | 64GB 256-bit LPDDR5 204.8GB/s |
64GB 256-bit LPDDR5 (+ ECC) 204.8GB/s |
32GB 256-bit LPDDR5 204.8GB/s |
16GB 128-bit LPDDR5 102.4GB/s |
8GB 128-bit LPDDR5 102.4GB/s |
8GB 128-bit LPDDR5 102 GB/s |
8GB 128-bit LPDDR5 102 GB/s |
4GB 64-bit LPDDR5 51 GB/s |
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Storage | 64GB eMMC 5.1 | - (Supports external NVMe) |
- (SD Card Slot & external NVMe via M.2 Key M) |
- (Supports external NVMe) |
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Video Encode | 2x 4K60 (H.265) 4x 4K30 (H.265) 8x 1080p60 (H.265) 16x 1080p30 (H.265) |
1x 4K60 (H.265) 3x 4K30 (H.265) 7x 1080p60 (H.265) 15x 1080p30 (H.265) |
1x 4K60 (H.265) 3x 4K30 (H.265) 6x 1080p60 (H.265) 12x 1080p30 (H.265) |
1080p30 supported by 1-2 CPU cores |
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Video Decode | 1x 8K30 (H.265) 3x 4K60 (H.265) 7x 4K30 (H.265) 11x 1080p60 (H.265) 22x 1080p30 (H.265) |
1x 8K30 (H.265) 3x 4K60 (H.265) 7x 4K30 (H.265) 11x 1080p60 (H.265) 23x 1080p30 (H.265) |
1x 8K30 (H.265) 2x 4K60 (H.265) 4x 4K30 (H.265) 9x 1080p60 (H.265) 18x 1080p30 (H.265) |
1x 4K60 (H.265) 2x 4K30 (H.265) 5x 1080p60 (H.265) 11x 1080p30 (H.265) |
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CSI Camera | 16-lane MIPI CSI-2 connector |
Up to 6 cameras (16 via virtual channels) 16 lanes MIPI CSI-2 D-PHY 2.1 (up to 40Gbps) | C-PHY 2.0 (up to 164Gbps) |
Up to 4 cameras (8 via virtual channels***) 8 lanes MIPI CSI-2 D-PHY 2.1 (up to 20Gbps) |
2x MIPI CSI-2 22-pin Camera Connectors | Up to 4 cameras (8 via virtual channels***) 8 lanes MIPI CSI-2 D-PHY 2.1 (up to 20Gbps) |
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PCIe* | x16 PCIe slot supporting x8 PCIe Gen4 M.2 Key M slot with x4 PCIe Gen4 M.2 Key E slot with x1 PCIe Gen4 |
Up to 2 x8 + 1 x4 + 2 x1 (PCIe Gen4, Root Port, & Endpoint) |
1 x4 + 3 x1 (PCIe Gen4, Root Port, & Endpoint) |
M.2 Key M slot with x4 PCIe Gen3 M.2 Key M slot with x2 PCIe Gen3 M.2 Key E slot |
1 x4 + 3 x1 (PCIe Gen3, Root Port, & Endpoint) |
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USB* | USB Type-C connector: 2x USB 3.2 Gen2 USB Type-A connector: 2x USB 3.2 Gen2, 2x USB 3.2 Gen1 USB Micro-B connector: USB 2.0 |
3x USB 3.2 Gen2 (10 Gbps) 4x USB 2.0 |
3x USB 3.2 Gen2 (10 Gbps) 3x USB 2.0 |
USB Type-A Connector: 4x USB 3.2 Gen2 USB Type-C Connector for UFP |
3x USB 3.2 Gen2 (10 Gbps) 3x USB 2.0 |
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Networking* | RJ45 connector with up to 10 GbE | 1x GbE 1x 10GbE |
1x GbE | 1xGbE Connector | 1x GbE | ||||
Display | 1x DisplayPort 1.4a (+MST) connector | 1x 8K60 multi-mode DP 1.4a (+MST)/eDP 1.4a/HDMI 2.1 | 1x 8K30 multi-mode DP 1.4a (+MST)/eDP 1.4a/HDMI 2.1 | 1x DisplayPort 1.2 (+MST) connector | 1x 4K30 multi-mode DP 1.2 (+MST)/eDP 1.4/HDMI 1.4** | ||||
Other I/O | 40-pin header (UART, SPI, I2S, I2C, CAN, PWM, DMIC, GPIO) 12-pin automation header 10-pin audio panel header 10-pin JTAG header 4-pin fan header 2-pin RTC batter backup connector microSD slot DC power jack Power, Force Recovery, and Reset buttons |
4x UART, 3x SPI, 4x I2S, 8x I2C, 2x CAN, PWM, DMIC & DSPK, GPIOs | 3x UART, 2x SPI, 2x I2S, 4x I2C, 1x CAN, DMIC & DSPK, PWM, GPIOs | 40-Pin Expansion Header(UART, SPI, I2S, I2C, GPIO) 12-pin button header 4-pin fan header microSD Slot DC power jack |
3x UART, 2x SPI, 2x I2S, 4x I2C, 1x CAN, DMIC & DSPK, PWM, GPIOs | ||||
Power | 15W - 60W | 15W-75W | 15W - 40W | 10W - 15W - 25W - 40W | 10W - 15W - 25W - 40W | 7W - 15W - 25W | 7W - 15W - 25W | 7W - 10W - 25W | |
Mechanical | 110mm x 110mm x 71.65mm (Height includes feet, carrier board, module, and thermal solution) |
100mm x 87mm 699-pin Molex Mirror Mezz Connector Integrated Thermal Transfer Plate |
69.6mm x 45mm 260-pin SO-DIMM connector |
100 mm x 79 mmx 21 mm (Height includes feet, carrier board, module, and thermal solution) |
69.6mm x 45mm 260-pin SO-DIMM connector |
† The Jetson Nano and Jetson Xavier NX modules included as part of the Jetson Nano developer kit and the Jetson Xavier NX developer kit have slots for using microSD cards instead of eMMC as system storage devices.
*USB 3.2, MGBE, and PCIe share UPHY Lanes. See the Product Design Guide for supported UPHY configurations.
**See the Jetson Orin Nano Series Data Sheet for more details on additional compatibility to DP 1.4a and HDMI 2.1
***Virtual Channels for Jetson Orin NX and Jetson Orin Nano are subject to change
Refer to the Software Features section of the latest NVIDIA Jetson Linux Developer Guide for a list of supported features.
See the Jetson Orin compute performance comparison.
Learn more about Jetson Orin and how ecosystem partners and customers are tapping into the Jetson platform to bring powerful AI solutions to market.
The Jetson partner ecosystem offers a wide range of AI and system software, developer tools, and custom software development. A variety of Jetson Orin systems and carrier boards are available, as well as peripherals such as sensors, cameras, connectivity modules (5G, 4G, Wi-Fi), and more.
Many AI applications have common needs: classification, object detection, language translation, text-to-speech, recommender engines, sentiment analysis, and more. Pretrained models from the NVIDIA NGC™ catalog are performance-optimized and ready to be fine-tuned with the NVIDIA TAO Toolkit and customer datasets, reducing time and cost for production of AI software development.
NVIDIA software platforms—including NVIDIA Isaac™ for robotics, Riva for AI speech, and Metropolis for video analytics —are available to speed vertical-specific applications.
Jetson AGX Orin series | Jetson Orin NX series | Jetson Orin Nano series | |||||||
Jetson AGX Orin Developer Kit | Jetson AGX Orin 64GB | Jetson AGX Orin Industrial | Jetson AGX Orin 32GB | Jetson Orin NX 16GB (Super) | Jetson Orin NX 8GB (Super) | Jetson Orin Nano Super Developer Kit | Jetson Orin Nano 8GB (Super) | Jetson Orin Nano 4GB (Super) | |
Overall AI Performance | 275 SPARSE INT8 TOPS | 248 SPARSE INT8 TOPs | 200 SPARSE INT8 TOPS | 157 SPARSE INT8TOPS | 117 SPARSE INT8 TOPS | 67 SPARSE INT8 TOPS | 34 SPARSE INT8 TOPS | ||
GPU Tensor Core INT8 Performance | 170 SPARSE INT8 TOPs | 85 DENSE INT8 TOPs |
156 SPARSE INT8 TOPs | 78 DENSE INT8 TOPs |
108 SPARSE INT8 TOPs | 54 DENSE INT8 TOPs |
77 SPARSE INT8 TOPs | 38 DENSE INT8 TOPs |
77 SPARSE INT8 TOPs | 38 DENSE INT8 TOPs |
67 SPARSE INT8 TOPs 33 DENSE INT8 TOPs |
34 SPARSE INT8 TOPs 17 DENSE INT8 TOPs |
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GPU Tensor Core FP16 Performance | 85 SPARSE FP16 TFLOPs | 43 DENSE FP16 TFLOPs |
78 SPARSE FP16 TFLOPs | 39 DENSE FP16 TFLOPs |
54 SPARSE FP16 TFLOPs | 27 DENSE FP16 TFLOPs |
38 SPARSE FP16 TFLOPs | 19 DENSE FP16 TFLOPs |
38 SPARSE FP16 TFLOPs | 19 DENSE FP16 TFLOPs |
33 SPARSE FP16 TFLOPs 17 DENSE FP16 TFLOPs |
17 SPARSE FP16 TFLOPs 8.5 DENSE FP16 TFLOPs |
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DLA INT8 Performance | 105 SPARSE INT8 TOPs | 52.5 DENSE INT8 TOPs |
92 SPARSE INT8 TOPs | 46 DENSE INT8 TOPs |
92 SPARSE INT8 TOPs | 46 DENSE INT8 TOPs |
80 SPARSE INT8 TOPs | 40 DENSE INT8 TOPs |
40 SPARSE INT8 TOPs | 20 DENSE INT8 TOPs |
~ | ~ | ||
GPU CUDA Core Performance | 5.3 FP32 TFLOPs | 10.6 FP16 TFLOPs |
4.8 FP32 TFLOPs | 9.6 FP16 TFLOPs |
3.8 FP32 TFLOPs | 7.6 FP16 TFLOPs |
2.4 FP32 TFLOPs | 4.8 FP16 TFLOPs |
2.4 FP32 TFLOPs | 4.8 FP16 TFLOPs |
2.1 FP32 TFLOPs 4.2 FP16 TFLOPs |
1.04 FP32 TFLOPs 2.08 FP16 TFLOPs |
Jetson AGX Orin Commercial | Jetson AGX Orin Industrial | |
Mechanical Shock | Non-Operational: 140G, 2 ms | Non-Operational: 140G, 2 ms Operational 50G, 11 ms |
Vibration | Non-Operational: 3G | Non-Operational: 3G Operational: 5G |
Temperature | -25°C - 80°C at TTP Surface | -40°C - 85°C at TTP Surface |
Humidity | 85°C, 85% RH, 168 hours | : 85°C / 85% RH, 1000 hours, Power ON |
Temperature Endurance | -20°C, 24 hours 45°C, 168 hours (operational) |
-40°C, 72 hours 85°C, 1000 hours (operational) |
ECC | N/A | Inline DRAM ECC Supported |
Underfill | N/A | SoC Corner Bonding & Component Underfill |
Operating Lifetime | 5 Years | 10 Years |